Use Moldex3D Designer’s “Modify Node Seeding” Feature to Further Improve Mesh Quality

Refining node seeding at the gate location can further improve mesh quality which ultimately leads to better accuracy of simulation analyses. Moldex3D R13.0 Designer supports auto-refine function for curvature and proximity to correct mesh defects firsthand. Then, users may use “Modify node seeding” feature to manually refine node seeding at the gate location or other segments of the mesh to further enhance mesh quality for a more robust simulation analysis.

Step 1. Click and  in the first dialog to apply default size setting. As shown below, the node distribution quality is overall good. However it is suggested to refine the node seeding at the gate location to further improve the mesh quality and analysis results.

Step 2. To increase the number of nodes at the gate location, the second dialog enables users to locally refine the node seeding. In this dialog, choose the segment where the cavity connects to the runner to manually refine the node seeding. Specify seeding parameter in this segment and click “Enter” to apply

(Important! Do not click   ). The new refined node distribution can then be seen as below.

Before manually refine the node seeding	After manually refine the node seeding

Step 3. Repeat Step 2 in the segment where the runner (not cavity) connects to the cavity (not runner) to manually refine the node seeding. Make sure the node distribution set in Step 2 & 3 matches with each other and then click to apply a new size setting. Based on the refined node seeding, the mesh quality is further improved as shown below.

Plate Heat Exchanger T Series

The flat sheets are processed using a dedicated high-precision fully automatic uncoiling, leveling and shearing production line to achieve high precision, low stress (six-fold precision leveling), full protection (online double-sided lamination), and traceability (online laser marking) of thin sheets )'s automated flow operation ensures high-quality full stress relief from coiled plate to flat plate and flatness of the plate before forming.

The press system using anti-compensation technology and the high-precision mold cooperate to ensure that the entire plane pressure of the pressing mold is consistent, so that the corrugation depth accuracy deviation is controlled at ±0.1-0.2mm, which is higher than the industry standard of ±0.25mm, ensuring that the plate After being assembled upside down, the corrugated contacts are in 100% complete contact, which greatly improves the plate's pressure-bearing capacity, alternating current resistance, and impact resistance.
Laser marking enables each plate to be permanently marked and retained for life, making it easy for users to trace and inquire.
Large plates adopt double-sided coating processing technology to achieve the ultimate forming accuracy of the plates. The maximum processing thinning amount is only 20% of the plate thickness, which is higher than the 23% specified by the industry standard; at the same time, the surface of the plates after forming is Scratches greatly extend the service life of the plate.
All holes in the plate are punched out at once after the overall one-time pressing, ensuring the assembly and positioning accuracy of the plate (including 4 corner holes, 2 plate positioning holes, 4 auxiliary positioning corners and peripheral pads card slot).
The only intelligent visual inspection system for plates in the industry can automatically identify all through-cracks and micro-cracks on plates, automatically detect corrugation depth deviations, and automatically detect all unqualified plates, ensuring zero defects in factory products.

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